Product Description
Revolutionize Your Production with Unmatched Efficiency
Introducing the groundbreaking Four-Head Roll-to-Roll Laser Drilling Equipment – the industry’s first solution designed to revolutionize high-volume electronics manufacturing. As a pioneer in multi-head laser drilling technology, this equipment delivers unprecedented 4x efficiency improvements while maintaining superior precision standards. Engineered for the most demanding production environments, this machine represents the future of automated electronics manufacturing, combining cutting-edge technology with proven reliability.
Highlights
4-Head Synchronous Processing
Optimized Process (Plasma-Free)
Picosecond UV Laser Source
Massive 4X Efficiency Boost:
Dramatically increase output and meet tight deadlines for large orders.
Dramatically increase output and meet tight deadlines for large orders.
Laser parameters are fine-tuned to eliminate the need for post-drilling plasma treatment.Reduce process steps, save on consumables, and simplify your production line.
Superior Hole Quality:No burrs, cracks, or thermal damage. Perfect for delicate materials like polyimide and glass.
Precision & Quality Assurance
Roll-to-Roll / Roll-to-Sheet/Sheet-to-sheet Flexibility
Our Four-Head Laser Drilling Machine delivers exceptional precision with microscopic accuracy. The image above demonstrates the quality of drilling results on various materials including PCB, battery separator, and flexible circuit samples. Each hole is perfectly round and uniform, showcasing the machine’s ability to maintain consistent quality across high-volume production runs.
Supports roll-to-roll, roll-to-sheet, and sheet-to-sheet automation for diverse manufacturing needs
Efficiency Comparison
The chart clearly illustrates the dramatic efficiency gains achieved with our Four-Head system compared to traditional single-head equipment. Customers experience:
4x increase in production capacity
Significant reduction in production time
Lower operational costs per unit
Improved return on investment
4x increase in production capacity
Significant reduction in production time
Lower operational costs per unit
Improved return on investment
Specification
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Product Name
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Four-Head Laser Drilling Equipment: 4x Higher Efficiency for High-Volume PCB & Semiconductor Manufacturing
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Laser Type
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Nanosecond UV, Picosecond UV, Picosecond green laser
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Processing area
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550mm×1500mm (customized)
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Machine size
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7200mm×2300mm×2250mm (Equipment with Upper and Lower Coil Material)
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Machine processing accuracy
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±0.02mm
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Electric power loading
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Main Unit +30kW Chiller +7kW Exhaust Fan +11kW
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Machine weight
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8000KG
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Environment requirements
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Humidity: 40% – 60% no condensation;
Temperature: 22℃±2 |
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