Easy-Programming Desktop PCB Soldering Robort Selective Wave Soldering Machine (FS-250C)
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| Feature | Details |
| Model | FS-250C |
| Automation Grade | Semi-Automatic |
| PCB Size Range | Min: $60 \times 40 \text{ mm}$ / Max: $330 \times 250 \text{ mm}$ |
| Max PCB Weight | $5 \text{ kg}$ |
| Clearance (Height) | Top: $180 \text{ mm}$ / Bottom: $30 \text{ mm}$ |
| Temperature Range | Max $400^{\circ}\text{C}$ |
| Warm-up Time | Approx. $30 \text{ min}$ (to $300^{\circ}\text{C}$) |
| Control System | PC + PLC |
| Startup Power | $5.5 \text{ kW}$ |
| Operating Height | $900 \pm 20 \text{ mm}$ |
| Dimensions | $1050 \times 1050 \times 1400 \text{ mm}$ |
| Certifications | CE, ISO, PSE, CCC |
Product Description
Economical and practical type semi-automatic selective wave soldering machine FS-250C.
1.The machine integrates flux spraying,and soldering;The solder pot is fixed,and the PCB board moves to realize soldering;
2.Maximum PCB dimensions:300X300mm.Small in occupation space and low in energy consumption;
3.Manual placement and removal of boards.It is particularly suitable the products of NPI.
4.Preheating function and size can be added according to different needs of customers.
5.Advantages between selective wave soldering and other soldering technologies.
6.It has High soldering yield and through rate.Good quality consistence.Low operation cost and low tooling cost and flexible process.
7.Certification: CE,Rohs,ISO.
8.Control method: Semi-Automatic.
9.Application: Electrical & Electronics Industry/Communication Industry.
Stable soldering quality with no voids and bridges
The soldering program can be set according to your desired soldering criteria.such as tin transmission, soldering joint fullness, and exposure of component feet.
Nozzles can also be customized for your PCB.
| specifications | Parameter |
| Overall Dimensions | 1050L*1050W*1400H (mm) |
| Operating height | 900±20mm |
| Weight | Approx.280KG |
| Power supply | 1φ 220V 50/60HZ |
| Total power | 5.5KW |
| PCB PCB parameter | |
| PCB PCB size | Min:60(L)*40(W); Max:330(L)*250(W)(mm) |
| Top component height | Max180mm |
| Bottom component height | Max30mm |
| PCB PCB Weight | Max5Kg |
| PCB PCB Process Edge | >3mm |
| N2 protection system | |
| N2 protection mode | Nozzle and solder pot |
| N2 flow control | Digital flow control |
| Exhaust system | |
| Top cover exhaust | Customer supply |
| Exhaust quantity | 1 1 PCS |
| Exhaust volume | 5m³/h() About 5m³/h |
| Control system | |
| Control mode | PC+ PC+ motion control card |
| PCB PCB Process parameter |
PC,, Setting, save , open in the PC screen |
| Other | PCB,,PC PCB counting, message, alarm can be read in the PC |
| Option | |
| Top safe cover | |
| Welding real-time monitoring | |
| Common Wear & Tear Parts | |
| Spray flux nozzle, Soldering nozzle | |
1,FLUX SPRAY MODULE
Spray characteristics
Selective sprayer,saves at least 90% flux than traditional spray.Ionic contamination is dramatically reduced.
Spray width can be as small as 2mm to significantly reduce ionic contamination.Needn’t clean PCBA.
Two axes servo motor control, high positioning accuracy.
2,PER-HEATING MODULE
Nowadays’ soldering processes, especially in the face of lead-free soldering, multilayer boards, and the soldering of large hot-melt components, also place high demands on preheating capabilities.
Sundarc selective wave soldering machine preheating module adopts short-wave infrared preheating at the bottom and hot air convection preheating at the top to ensure full and balanced preheating.
3,SOLDERING MODULE
PCB plate fixed, spray and soldering X/Y/Z axis platform moving for soldering joints.
Different soldering speeds and times can be set for different soldering joints on the same circuit board;
Nitrogen heating of the tin pot ensures good wetting of the nozzles and reduces the tin dross;
Wave height monitoring online;
Real-time monitoring of tin pot high and low levels;
4,THE SOFTWARE FEATURES
(1).Full PC control. All parameters can set in PC and saved to PCB menu, like moving path, solder temperature, flux type, solder type ,n2 temperature etc, best trace-ability and easy to get repeat soldering quality.
(2).Simple programming method, using the picture as a base, just draw lines on the picture to program. Parameters can be optimized for each soldering joint position, such as Z-axis soldering height, crest height, soldering travel speed, tin shrinking speed and time, etc. After the path editing is completed, the program can simulate the time needed for the required soldering. It is convenient for engineers to account for the beats.
(3).Path, temperature, speed, solder material and other data are all saved in one file, which can be exported as an EXCEL file. Parameters can be optimized for each soldering position, such as Z-axis soldering height, wave height, soldering movement speed, shrinking speed and time, and so on. After the path is edited, the program can simulate the time required for soldering.
(4).Soldering coordinate point visual positioning, The whole soldering CCD image visualization to facilitate the whole soldering quality tracking.
Customer Reviews
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