Easy-Programming Desktop PCB Soldering Robort Selective Wave Soldering Machine (FS-250C)
Easy-Programming Desktop PCB Soldering Robort Selective Wave Soldering Machine (FS-250C) Original price was: $19,000.00.Current price is: $18,000.00.
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New Automatic Battery Pack Production Line Manufacturer Original price was: $151,000.00.Current price is: $150,000.00.

Automatic Dual Solder Pot Selective Wave Soldering Machine Suitable for Large-Scale PCB Production (XS-350C)

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Feature Details
Model XS-350C
Solder Pots 2 Independent Sets (with XYZ Control)
PCB Size Range $120 \times 50 \text{ mm}$ to $400 \times 350 \text{ mm}$
Max PCB Weight $5 \text{ kg}$
Component Clearance Top: $120 \text{ mm}$ / Bottom: $30 \text{ mm}$
Preheating Mode Far Infrared (Top & Bottom Zones)
Warm-up Time $20 \text{ min}$
Total Power $25 \text{ kW}$ (Startup)
Power Supply $3\phi \text{ 380V, 50/60Hz}$
Control System PC + Motion Control Card
Weight Approx. $900 \text{ kg}$
Dimensions $3100 \times 1400 \times 1580 \text{ mm}$

Original price was: $65,134.00.Current price is: $64,134.00.

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Product care

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Product Description

Product overview

The XS-350C is a state-of-the-art automation selective wave soldering machine designed for high-efficiency, precision soldering in industrial applications.
Combining advanced modular design and stable performance, it ensures optimal flexibility and reliability for mass production environments.

Automatic Dual Solder Pot Selective Wave Soldering Machine Suitable for Large-Scale PCB Production (XS-350C)

Structure introduction

Automatic Dual Solder Pot Selective Wave Soldering Machine Suitable for Large-Scale PCB Production (XS-350C)

Integrated Process Flow

Full-process integration: Flux application +Top&bottom preheating + Top preheating 1 & soldering 1 + Top preheating 2 & soldering 2.

Ensures consistent soldering quality and reduces thermal stress on components.

Seamless Production Line Integration

On-line transportation capability for continuous in-line production with upstream/downstream equipment.

Modular & Scalable Design

Flexible configuration allows free expansion and module collocation based on production needs.

Product Parameters
specifications Parameter
Size 3100L*1400W*1580H (mm)
Power supply 3φ 380V  50/60HZ
Total power 25KW
PCB parameter
PCB size Min:120(L)*50(W);Max:400(L)*350(W)(mm)
Top component height Max120mm
Bottom component height Max30mm
Selective spray system
Spray movement mode Flux nozzle movement in XYZ axis
Spray flux volume 2L
Spray flux add mode Manual
Spray cycle time 0.1 Sec/ soldered dot
Spray movement precision 0.05mm
Selective preheat system
Preheat mode Far infrared ray+ Hot air
Heater position Top and bottom
Selective Soldering System
Soldering pot qty 2 sets pots with independent XYZ
Soldering movement mode Soldering pot movement in XYZ axis
Solder capacity 16KG
Solder melting time 30min
Solder nozzle size Standard D8mm, other sizes is option
Solder cycle time 2 Sec/ soldered dot
Temperature setting range Max400OC
Solder dross 0.2Kg/8h(Not N2 protection);0.01Kg/8h( N2 protection)
Conveyor system
Conveyor method Adopt rail + stainless roller
Exhaust system
Exhaust quantity 2 PCS
Exhaust volume About 5m³/h
Control system
Control mode  PC+ motion control card
Programming method Picture, GERBER or CAD file importing
PCB Process parameter Setting, save , open in the PC screen
Option
Sweep gun
Effect of soldering
Automatic Dual Solder Pot Selective Wave Soldering Machine Suitable for Large-Scale PCB Production (XS-350C)
XS-350C can achieve 100%  through hole soldr fill, Stable soldering quality with no voids and bridges.

It offer rock-solid connections that withstand mechanical stress, extreme temperatures, and environmental challenges.Adapting to automotive electrical aerospace requirements.

Solder nozzles can also be customized for your Dip process.

Key Features

1. Precision Flux Spray System

Selective spray technology reduces flux consumption by ≥90% vs traditional methods.
Ultra-narrow 2mm spray width minimizes ionic contamination (eliminates post-soldering PCB cleaning).
Dual-axis servo motor ensures ±0.02mm positioning accuracy.
Contamination levels meet IPC-J-STD-001 Class 3 standards.

Automatic Dual Solder Pot Selective Wave Soldering Machine Suitable for Large-Scale PCB Production (XS-350C)
2. Adaptive Preheating Module

Hybrid heating system for leaded/lead-free/multilayer PCB assembly:
▸Bottom heating: Short-wave infrared technology
▸Top heating: Forced hot-air convection
Integrated preheating stations for each soldering module

 

3. Intelligent Soldering Unit

Programmable per-joint parameters:
▸Differential soldering speeds
▸Custom dwell times (0.01-10s adjustable)
EM P

Product Description

Product overview

The XS-350C is a state-of-the-art automation selective wave soldering machine designed for high-efficiency, precision soldering in industrial applications.
Combining advanced modular design and stable performance, it ensures optimal flexibility and reliability for mass production environments.

Automatic Dual Solder Pot Selective Wave Soldering Machine Suitable for Large-Scale PCB Production (XS-350C)

Structure introduction

Automatic Dual Solder Pot Selective Wave Soldering Machine Suitable for Large-Scale PCB Production (XS-350C)

Integrated Process Flow

Full-process integration: Flux application +Top&bottom preheating + Top preheating 1 & soldering 1 + Top preheating 2 & soldering 2.

Ensures consistent soldering quality and reduces thermal stress on components.

Seamless Production Line Integration

On-line transportation capability for continuous in-line production with upstream/downstream equipment.

Modular & Scalable Design

Flexible configuration allows free expansion and module collocation based on production needs.

Product Parameters
specifications Parameter
Size 3100L*1400W*1580H (mm)
Power supply 3φ 380V  50/60HZ
Total power 25KW
PCB parameter
PCB size Min:120(L)*50(W);Max:400(L)*350(W)(mm)
Top component height Max120mm
Bottom component height Max30mm
Selective spray system
Spray movement mode Flux nozzle movement in XYZ axis
Spray flux volume 2L
Spray flux add mode Manual
Spray cycle time 0.1 Sec/ soldered dot
Spray movement precision 0.05mm
Selective preheat system
Preheat mode Far infrared ray+ Hot air
Heater position Top and bottom
Selective Soldering System
Soldering pot qty 2 sets pots with independent XYZ
Soldering movement mode Soldering pot movement in XYZ axis
Solder capacity 16KG
Solder melting time 30min
Solder nozzle size Standard D8mm, other sizes is option
Solder cycle time 2 Sec/ soldered dot
Temperature setting range Max400OC
Solder dross 0.2Kg/8h(Not N2 protection);0.01Kg/8h( N2 protection)
Conveyor system
Conveyor method Adopt rail + stainless roller
Exhaust system
Exhaust quantity 2 PCS
Exhaust volume About 5m³/h
Control system
Control mode  PC+ motion control card
Programming method Picture, GERBER or CAD file importing
PCB Process parameter Setting, save , open in the PC screen
Option
Sweep gun
Effect of soldering
Automatic Dual Solder Pot Selective Wave Soldering Machine Suitable for Large-Scale PCB Production (XS-350C)
XS-350C can achieve 100%  through hole soldr fill, Stable soldering quality with no voids and bridges.

It offer rock-solid connections that withstand mechanical stress, extreme temperatures, and environmental challenges.Adapting to automotive electrical aerospace requirements.

Solder nozzles can also be customized for your Dip process.

Key Features

1. Precision Flux Spray System

Selective spray technology reduces flux consumption by ≥90% vs traditional methods.
Ultra-narrow 2mm spray width minimizes ionic contamination (eliminates post-soldering PCB cleaning).
Dual-axis servo motor ensures ±0.02mm positioning accuracy.
Contamination levels meet IPC-J-STD-001 Class 3 standards.

Automatic Dual Solder Pot Selective Wave Soldering Machine Suitable for Large-Scale PCB Production (XS-350C)
2. Adaptive Preheating Module

Hybrid heating system for leaded/lead-free/multilayer PCB assembly:
▸Bottom heating: Short-wave infrared technology
▸Top heating: Forced hot-air convection
Integrated preheating stations for each soldering module

 

3. Intelligent Soldering Unit

Programmable per-joint parameters:
▸Differential soldering speeds
▸Custom dwell times (0.01-10s adjustable)
EM Pump Technology™ features:
▸Nitrogen-assisted solder pot
▸Real-time wave height monitoring (±0.05mm)
▸Automatic solder level detection
75% reduction in dross generation vs conventional systems

Automatic Dual Solder Pot Selective Wave Soldering Machine Suitable for Large-Scale PCB Production (XS-350C)
Automatic Dual Solder Pot Selective Wave Soldering Machine Suitable for Large-Scale PCB Production (XS-350C)
4. Smart Process Control Software

CAD-based Programming:
▸Drag-and-drop path creation on PCB image overlay
▸Parameter customization per solder joint:
Z-axis penetration depth
Centralized Data Management:
▸Unified file storage for process parameters (flux type, N2 temp, etc.)
▸Excel-compatible report generation
Dual-channel Control:
▸Independent parameter sets for simultaneous dual-nozzle operation

ump Technology™ features:
▸Nitrogen-assisted solder pot
▸Real-time wave height monitoring (±0.05mm)
▸Automatic solder level detection
75% reduction in dross generation vs conventional systems

Automatic Dual Solder Pot Selective Wave Soldering Machine Suitable for Large-Scale PCB Production (XS-350C)
Automatic Dual Solder Pot Selective Wave Soldering Machine Suitable for Large-Scale PCB Production (XS-350C)
4. Smart Process Control Software

CAD-based Programming:
▸Drag-and-drop path creation on PCB image overlay
▸Parameter customization per solder joint:
Z-axis penetration depth
Centralized Data Management:
▸Unified file storage for process parameters (flux type, N2 temp, etc.)
▸Excel-compatible report generation
Dual-channel Control:
▸Independent parameter sets for simultaneous dual-nozzle operation

 

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