Automatic Dual Solder Pot Selective Wave Soldering Machine Suitable for Large-Scale PCB Production (XS-350C)
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| Feature | Details |
| Model | XS-350C |
| Solder Pots | 2 Independent Sets (with XYZ Control) |
| PCB Size Range | $120 \times 50 \text{ mm}$ to $400 \times 350 \text{ mm}$ |
| Max PCB Weight | $5 \text{ kg}$ |
| Component Clearance | Top: $120 \text{ mm}$ / Bottom: $30 \text{ mm}$ |
| Preheating Mode | Far Infrared (Top & Bottom Zones) |
| Warm-up Time | $20 \text{ min}$ |
| Total Power | $25 \text{ kW}$ (Startup) |
| Power Supply | $3\phi \text{ 380V, 50/60Hz}$ |
| Control System | PC + Motion Control Card |
| Weight | Approx. $900 \text{ kg}$ |
| Dimensions | $3100 \times 1400 \times 1580 \text{ mm}$ |
Product Description
The XS-350C is a state-of-the-art automation selective wave soldering machine designed for high-efficiency, precision soldering in industrial applications.
Combining advanced modular design and stable performance, it ensures optimal flexibility and reliability for mass production environments.
Full-process integration: Flux application +Top&bottom preheating + Top preheating 1 & soldering 1 + Top preheating 2 & soldering 2.
Ensures consistent soldering quality and reduces thermal stress on components.
Seamless Production Line Integration
On-line transportation capability for continuous in-line production with upstream/downstream equipment.
Modular & Scalable Design
Flexible configuration allows free expansion and module collocation based on production needs.
| specifications | Parameter |
| Size | 3100L*1400W*1580H (mm) |
| Power supply | 3φ 380V 50/60HZ |
| Total power | 25KW |
| PCB parameter | |
| PCB size | Min:120(L)*50(W);Max:400(L)*350(W)(mm) |
| Top component height | Max120mm |
| Bottom component height | Max30mm |
| Selective spray system | |
| Spray movement mode | Flux nozzle movement in XYZ axis |
| Spray flux volume | 2L |
| Spray flux add mode | Manual |
| Spray cycle time | 0.1 Sec/ soldered dot |
| Spray movement precision | 0.05mm |
| Selective preheat system | |
| Preheat mode | Far infrared ray+ Hot air |
| Heater position | Top and bottom |
| Selective Soldering System | |
| Soldering pot qty | 2 sets pots with independent XYZ |
| Soldering movement mode | Soldering pot movement in XYZ axis |
| Solder capacity | 16KG |
| Solder melting time | 30min |
| Solder nozzle size | Standard D8mm, other sizes is option |
| Solder cycle time | 2 Sec/ soldered dot |
| Temperature setting range | Max400OC |
| Solder dross | 0.2Kg/8h(Not N2 protection);0.01Kg/8h( N2 protection) |
| Conveyor system | |
| Conveyor method | Adopt rail + stainless roller |
| Exhaust system | |
| Exhaust quantity | 2 PCS |
| Exhaust volume | About 5m³/h |
| Control system | |
| Control mode | PC+ motion control card |
| Programming method | Picture, GERBER or CAD file importing |
| PCB Process parameter | Setting, save , open in the PC screen |
| Option | |
| Sweep gun | |
It offer rock-solid connections that withstand mechanical stress, extreme temperatures, and environmental challenges.Adapting to automotive electrical aerospace requirements.
Solder nozzles can also be customized for your Dip process.
1. Precision Flux Spray System
Selective spray technology reduces flux consumption by ≥90% vs traditional methods.
Ultra-narrow 2mm spray width minimizes ionic contamination (eliminates post-soldering PCB cleaning).
Dual-axis servo motor ensures ±0.02mm positioning accuracy.
Contamination levels meet IPC-J-STD-001 Class 3 standards.
Hybrid heating system for leaded/lead-free/multilayer PCB assembly:
▸Bottom heating: Short-wave infrared technology
▸Top heating: Forced hot-air convection
Integrated preheating stations for each soldering module
Programmable per-joint parameters:
▸Differential soldering speeds
▸Custom dwell times (0.01-10s adjustable)
EM P
Product Description
The XS-350C is a state-of-the-art automation selective wave soldering machine designed for high-efficiency, precision soldering in industrial applications.
Combining advanced modular design and stable performance, it ensures optimal flexibility and reliability for mass production environments.
Full-process integration: Flux application +Top&bottom preheating + Top preheating 1 & soldering 1 + Top preheating 2 & soldering 2.
Ensures consistent soldering quality and reduces thermal stress on components.
Seamless Production Line Integration
On-line transportation capability for continuous in-line production with upstream/downstream equipment.
Modular & Scalable Design
Flexible configuration allows free expansion and module collocation based on production needs.
| specifications | Parameter |
| Size | 3100L*1400W*1580H (mm) |
| Power supply | 3φ 380V 50/60HZ |
| Total power | 25KW |
| PCB parameter | |
| PCB size | Min:120(L)*50(W);Max:400(L)*350(W)(mm) |
| Top component height | Max120mm |
| Bottom component height | Max30mm |
| Selective spray system | |
| Spray movement mode | Flux nozzle movement in XYZ axis |
| Spray flux volume | 2L |
| Spray flux add mode | Manual |
| Spray cycle time | 0.1 Sec/ soldered dot |
| Spray movement precision | 0.05mm |
| Selective preheat system | |
| Preheat mode | Far infrared ray+ Hot air |
| Heater position | Top and bottom |
| Selective Soldering System | |
| Soldering pot qty | 2 sets pots with independent XYZ |
| Soldering movement mode | Soldering pot movement in XYZ axis |
| Solder capacity | 16KG |
| Solder melting time | 30min |
| Solder nozzle size | Standard D8mm, other sizes is option |
| Solder cycle time | 2 Sec/ soldered dot |
| Temperature setting range | Max400OC |
| Solder dross | 0.2Kg/8h(Not N2 protection);0.01Kg/8h( N2 protection) |
| Conveyor system | |
| Conveyor method | Adopt rail + stainless roller |
| Exhaust system | |
| Exhaust quantity | 2 PCS |
| Exhaust volume | About 5m³/h |
| Control system | |
| Control mode | PC+ motion control card |
| Programming method | Picture, GERBER or CAD file importing |
| PCB Process parameter | Setting, save , open in the PC screen |
| Option | |
| Sweep gun | |
It offer rock-solid connections that withstand mechanical stress, extreme temperatures, and environmental challenges.Adapting to automotive electrical aerospace requirements.
Solder nozzles can also be customized for your Dip process.
1. Precision Flux Spray System
Selective spray technology reduces flux consumption by ≥90% vs traditional methods.
Ultra-narrow 2mm spray width minimizes ionic contamination (eliminates post-soldering PCB cleaning).
Dual-axis servo motor ensures ±0.02mm positioning accuracy.
Contamination levels meet IPC-J-STD-001 Class 3 standards.
Hybrid heating system for leaded/lead-free/multilayer PCB assembly:
▸Bottom heating: Short-wave infrared technology
▸Top heating: Forced hot-air convection
Integrated preheating stations for each soldering module
Programmable per-joint parameters:
▸Differential soldering speeds
▸Custom dwell times (0.01-10s adjustable)
EM Pump Technology™ features:
▸Nitrogen-assisted solder pot
▸Real-time wave height monitoring (±0.05mm)
▸Automatic solder level detection
75% reduction in dross generation vs conventional systems
CAD-based Programming:
▸Drag-and-drop path creation on PCB image overlay
▸Parameter customization per solder joint:
Z-axis penetration depth
Centralized Data Management:
▸Unified file storage for process parameters (flux type, N2 temp, etc.)
▸Excel-compatible report generation
Dual-channel Control:
▸Independent parameter sets for simultaneous dual-nozzle operation
ump Technology™ features:
▸Nitrogen-assisted solder pot
▸Real-time wave height monitoring (±0.05mm)
▸Automatic solder level detection
75% reduction in dross generation vs conventional systems
CAD-based Programming:
▸Drag-and-drop path creation on PCB image overlay
▸Parameter customization per solder joint:
Z-axis penetration depth
Centralized Data Management:
▸Unified file storage for process parameters (flux type, N2 temp, etc.)
▸Excel-compatible report generation
Dual-channel Control:
▸Independent parameter sets for simultaneous dual-nozzle operation
Customer Reviews
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