Factory Price Fiber Laser Cutting Machine

Technical parameters

Product introduction

Laser cutting is to use high-energy laser beam to illuminate the workpiece surface,to partially melt and vaporize
the exposed area so as to achieve the purpose of slicing.Using fiber laser as working light source,controlled by
computer,can do all kinds of motion according to the input graph.High output power, high chip precision, fast
speed,can cut curves and straight lines.
Applicable materials and industries

Suitable for single crystal silicon, polycrystalline silicon battery materials,and silicon, germanium, gallium arsenide
semiconductor materials slicing and cutting.
The characteristics of laser slicing

Because the laser is focused by a special optical system into a very small point of light, high energy density.
Because of its non – contact processing, minimal thermal impact, high precision, widely used in solar panels,
thin metal chip slicing and cutting.

1. High configuration

Using 30W fiber laser, good beam quality, finer cutting seam, smooth edge.

2. No maintenance

Adopts standard modular design, no maintenance, continuous running without interruption, no consumable
parts replacement.

3. Convenient operation

Integrated air – cooling Settings,  smaller equipment volume, easier operation.

4. Special control software

Control software specially designed for laser scribing machine,easy to operate, can display the  scribing
path in real time.

5. High efficiency

High speed and adjustable,can run for 24 hours.

6. Brand-new design

Simpler device structure and easier to use,software runs more stable and fast.